xingkong星空体育中国官方网站|在线平台 (the “Company”, together with its subsidiaries, the “Group”) is a world-leading manufacturer of mid-to-high end camera modules and fingerprint recognition modules for intelligent mobile terminals. The Group is primarily engaged in the design, research and development, manufacturing and sales of camera modules and fingerprint recognition modules and centred on mid-to-high end camera and fingerprint recognition module market for intelligent mobile terminals such as global smart phone and tablet personal computer (PC) brands, Internet of Things (IoT), smart vehicles, etc. The Group is one of the first few manufacturers in the PRC to use chip on board (“COB”) and chip on flex (“COF”) technologies and molding on board (“MOB”) and molding on chip (“MOC”) technologies in the manufacture of camera modules, as well as to produce and sell ultra-thin camera modules with resolutions of 200 mega pixels, dual/multiple camera modules, 3D modules, under-glass fingerprint recognition modules and fingerprint recognition modules with various technologies on a mass production scale. Currently, the Group’s product mix covers ultrathin camera modules ranging from 2 mega pixels to 200 mega pixels, dual/multiple camera modules, optical image stabilization (OIS) camera modules, periscope camera modules, 3D camera modules, automotive camera modules, smart home camera modules, capacitive fingerprint recognition modules, optical under-screen fingerprint recognition modules and ultrasonic fingerprint recognition modules. In addition, the Group also develops and sells the full line of automation equipment with Automated Optical Inspection (AOI) as core technology, and has established lidar business partnerships with a number of machine body robot companies and intelligent vehicle companies.